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- USA
- CAN
Ships within 48 hours · Estimated delivery Sep 27 - Oct 2
For Your Every Summer RSVP, with Code: SUMMER15
Description
Chip Quik TS391SNL250, Thermally Stable Solder Paste, No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (250g jar)Chip Quik TS391SNL250, Thermally Stable Solder Paste, No Clean Sn96. 5 Ag3. 0 Cu0. 5 T4 (250g jar) Chip Quik TS [Thermally Stable] Solder Paste No Clean Lead Free SAC305 in 250g jar. Revolutionary Formula: No Refrigeration Required! Specifications Alloy: Sn96. 5 Ag3. 0 Cu0. 5 Flux Type: Synthetic No Clean Flux Classification: ROL0 Metal Content: 88. 5% metal by weight. Particle Size: T4 (20 38 microns) Melting Point: 217 220C (423 428F) Size: 250g jar

Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy




